The Hysitron PI 89 scanning electron microscope combined with nanoindentation instrument utilizes the imaging capability of scanning electron microscopy (SEM, FIB/SEM) to perform quantitative nanomechanical testing while imaging. This new system is equipped with Bruker's superior capacitive sensing technology, inheriting the excellent functions of the first batch of commercialized in-situ SEM nanomechanical platforms in the market. This system can achieve functions including nanoindentation, stretching, micro column compression, microsphere compression, cantilever bending, fracture, fatigue, dynamic testing, and mechanical property imaging.

Advanced performance and functionality

The compact design of Hysitron PI 89 allows for a large sample stage tilt and measurementThe minimum working distance for imaging during testing. PI 89 provides researchers with broader applicability and performance than competing products:

• Redesigned structure increases applicability and usability
• A linear encoder with a precision of 1 nm achieves better automatic testing and positioning repeatability over a larger range
• Higher frame stiffness (~0.9 x 106 N/m) provides better stability during the testing process
• Two rotation/tilt modes are used to achieve urban-rural, FIB processing, and the combination of various detectors, including EDS, CBD, EBSD, and TKD.

Inherent displacement control

Hysitron PI 89 utilizes Bruker's advanced sub nanometer scale sensors and piezoelectric drive structure to achieve true displacement control and load control testing:

• In the inherent displacement control mode, the piezoelectric actuator achieves displacement control with a preset displacement rate, while the force sensor measures the force.
• In the true load control mode, the force sensor is directly loaded by electrostatic force, while measuring displacement through three plate capacitance.
• The ultra-low current design of the sensor minimizes temperature drift and enables extremely sensitive load and displacement measurements.

In situ mechanical testing synchronized with SEM imaging and other performance imaging

The in-situ mechanical test results obtained from Hysitron PI 89 are synchronized and displayed in parallel with SEM imaging. This enables users to observe the effects of defects, strain, and thermal/electrical stimulation on the performance, lifespan, and durability of engineering materials at the nanometer to micrometer scale. This synchronization enables more analysis:

• Rotating/tilting sample stage for EBSD and mechanical performance imaging combination
• Can perform FIB processing directly before and after mechanical performance testing without the need to switch cavities